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From: "gaoliming" <gaoliming@byosoft.com.cn>
To: <devel@edk2.groups.io>, <gaoliming@byosoft.com.cn>,
	<ray.ni@intel.com>, "'Tan, Lean Sheng'" <sheng.tan@9elements.com>
Cc: "'Wang, Jian J'" <jian.j.wang@intel.com>
Subject: 回复: [edk2-devel] [PATCH 1/3] MdeModulePkg/BmBoot: Skip removable media if it is not present
Date: Fri, 10 Mar 2023 10:20:44 +0800	[thread overview]
Message-ID: <007f01d952f6$eb893310$c29b9930$@byosoft.com.cn> (raw)
In-Reply-To: <174A9A2823F47D61.24021@groups.io>

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PR https://github.com/tianocore/edk2/pull/4127 is created for this patch. 

 

Thanks

Liming

发件人: devel@edk2.groups.io <devel@edk2.groups.io> 代表 gaoliming via groups.io
发送时间: 2023年3月9日 8:55
收件人: devel@edk2.groups.io; ray.ni@intel.com; 'Tan, Lean Sheng' <sheng.tan@9elements.com>
抄送: 'Wang, Jian J' <jian.j.wang@intel.com>
主题: 回复: [edk2-devel] [PATCH 1/3] MdeModulePkg/BmBoot: Skip removable media if it is not present

 

Ray:

 You also have access to merge the patch. Sure, I can help merge this patch. 

 

Thanks

Liming

发件人: devel@edk2.groups.io <mailto:devel@edk2.groups.io>  <devel@edk2.groups.io <mailto:devel@edk2.groups.io> > 代表 Ni, Ray
发送时间: 2023年3月8日 16:58
收件人: devel@edk2.groups.io <mailto:devel@edk2.groups.io> ; Tan, Lean Sheng <sheng.tan@9elements.com <mailto:sheng.tan@9elements.com> >
抄送: Wang, Jian J <jian.j.wang@intel.com <mailto:jian.j.wang@intel.com> >; Gao, Liming <gaoliming@byosoft.com.cn <mailto:gaoliming@byosoft.com.cn> >
主题: Re: [edk2-devel] [PATCH 1/3] MdeModulePkg/BmBoot: Skip removable media if it is not present

 

M: Jian J Wang jian.j.wang@intel.com <mailto:jian.j.wang@intel.com>  [jwang36]

M: Liming Gao gaoliming@byosoft.com.cn <mailto:gaoliming@byosoft.com.cn>  [lgao4]

 

Jian and Liming are maintainers of MdeModulePkg.

The patch passed my review. Either of them can help to merge the patch.

 

I guess Liming might not see this patch. I am sure he can help on merging it.

 

 

Thanks,

Ray

 

From: devel@edk2.groups.io <mailto:devel@edk2.groups.io>  <devel@edk2.groups.io <mailto:devel@edk2.groups.io> > On Behalf Of Sheng Lean Tan
Sent: Wednesday, March 8, 2023 4:55 PM
To: Tan, Lean Sheng <sheng.tan@9elements.com <mailto:sheng.tan@9elements.com> >; devel@edk2.groups.io <mailto:devel@edk2.groups.io> 
Subject: Re: [edk2-devel] [PATCH 1/3] MdeModulePkg/BmBoot: Skip removable media if it is not present

 

Seriously, what is the hold up here?
did Sean not following the process? Did he miss anything?
it just doesn’t make sense to keep ignoring this patch for half year for no reason. Is there a way to voice up a about this? 




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      parent reply	other threads:[~2023-03-10  2:20 UTC|newest]

Thread overview: 21+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2022-12-16  8:58 [PATCH 1/3] MdeModulePkg/BmBoot: Skip removable media if it is not present Sean Rhodes
2022-12-16  8:58 ` [PATCH 2/3] MdeModulePkg/XhciDxe/Xhci: Don't check for invalid PSIV Sean Rhodes
2022-12-19  6:16   ` Wu, Hao A
2022-12-21  0:48     ` [edk2-devel] " Wu, Hao A
2022-12-16  8:58 ` [PATCH 3/3] MdeModulePkg/Bus/Pci/XhciDxe: Check port is compatible before getting PSIV Sean Rhodes
2022-12-19  7:46   ` [edk2-devel] " Wu, Hao A
2022-12-21  0:49     ` Wu, Hao A
2022-12-16  9:03 ` [edk2-devel] [PATCH 1/3] MdeModulePkg/BmBoot: Skip removable media if it is not present Ni, Ray
2023-01-28 19:01   ` Sean Rhodes
2023-02-13 10:01     ` Sheng Lean Tan
2023-02-13 11:56       ` Ni, Ray
2023-02-17 12:56         ` Sheng Lean Tan
     [not found]         ` <17449DF2E9A4F10E.28744@groups.io>
2023-03-06  9:57           ` Sheng Lean Tan
2023-03-07 11:32             ` Sheng Lean Tan
2023-03-08  8:54               ` Sheng Lean Tan
2023-03-08  8:57                 ` Ni, Ray
2023-03-09  0:54                   ` 回复: " gaoliming
2023-03-10 11:29                     ` [edk2-devel] " Sheng Lean Tan
2023-03-15 16:41                       ` Sheng Lean Tan
2023-03-17  3:03                         ` 回复: " gaoliming
     [not found]                   ` <174A9A2823F47D61.24021@groups.io>
2023-03-10  2:20                     ` gaoliming [this message]

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