From mboxrd@z Thu Jan 1 00:00:00 1970 Received: from mga12.intel.com (mga12.intel.com [192.55.52.136]) by mx.groups.io with SMTP id smtpd.web10.1193.1573864619382017300 for ; Fri, 15 Nov 2019 16:36:59 -0800 Authentication-Results: mx.groups.io; dkim=missing; spf=pass (domain: intel.com, ip: 192.55.52.136, mailfrom: nathaniel.l.desimone@intel.com) X-Amp-Result: SKIPPED(no attachment in message) X-Amp-File-Uploaded: False Received: from fmsmga005.fm.intel.com ([10.253.24.32]) by fmsmga106.fm.intel.com with ESMTP/TLS/DHE-RSA-AES256-GCM-SHA384; 15 Nov 2019 16:36:59 -0800 X-ExtLoop1: 1 X-IronPort-AV: E=Sophos;i="5.68,310,1569308400"; d="scan'208";a="405511640" Received: from orsmsx109.amr.corp.intel.com ([10.22.240.7]) by fmsmga005.fm.intel.com with ESMTP; 15 Nov 2019 16:36:59 -0800 Received: from orsmsx155.amr.corp.intel.com (10.22.240.21) by ORSMSX109.amr.corp.intel.com (10.22.240.7) with Microsoft SMTP Server (TLS) id 14.3.439.0; Fri, 15 Nov 2019 16:36:58 -0800 Received: from orsmsx114.amr.corp.intel.com ([169.254.8.67]) by ORSMSX155.amr.corp.intel.com ([169.254.7.211]) with mapi id 14.03.0439.000; Fri, 15 Nov 2019 16:36:58 -0800 From: "Nate DeSimone" To: "Kubacki, Michael A" , "devel@edk2.groups.io" CC: "Bi, Dandan" , "Chaganty, Rangasai V" , "Dong, Eric" , "Gao, Liming" Subject: Re: [edk2-platforms][PATCH V1 43/49] Platform/Intel/Readme.md Content update Thread-Topic: [edk2-platforms][PATCH V1 43/49] Platform/Intel/Readme.md Content update Thread-Index: AQHVmdwqUrxAlBMGcUK/XwZZaOqxbKeMq8VA Date: Sat, 16 Nov 2019 00:36:58 +0000 Message-ID: <02A34F284D1DA44BB705E61F7180EF0AB5BDB7FD@ORSMSX114.amr.corp.intel.com> References: <20191113043742.23488-1-michael.a.kubacki@intel.com> <20191113043742.23488-4-michael.a.kubacki@intel.com> In-Reply-To: <20191113043742.23488-4-michael.a.kubacki@intel.com> Accept-Language: en-US X-MS-Has-Attach: X-MS-TNEF-Correlator: dlp-product: dlpe-windows dlp-version: 11.2.0.6 dlp-reaction: no-action x-titus-metadata-40: eyJDYXRlZ29yeUxhYmVscyI6IiIsIk1ldGFkYXRhIjp7Im5zIjoiaHR0cDpcL1wvd3d3LnRpdHVzLmNvbVwvbnNcL0ludGVsMyIsImlkIjoiOGVlNDNiNzUtYzBhNC00YzJlLWFlOTAtMzg0YjM4ZmRhY2Q4IiwicHJvcHMiOlt7Im4iOiJDVFBDbGFzc2lmaWNhdGlvbiIsInZhbHMiOlt7InZhbHVlIjoiQ1RQX05UIn1dfV19LCJTdWJqZWN0TGFiZWxzIjpbXSwiVE1DVmVyc2lvbiI6IjE3LjEwLjE4MDQuNDkiLCJUcnVzdGVkTGFiZWxIYXNoIjoiMnFyWG5sd1lrTFNFKzRhWGlaWDNyWG05OVlGM1crUmM3aDFsRnVLWlp6UUpGTlVBSzVZN2YxNlhmUEVJejlmTSJ9 x-ctpclassification: CTP_NT x-originating-ip: [10.22.254.140] MIME-Version: 1.0 Return-Path: nathaniel.l.desimone@intel.com Content-Language: en-US Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: quoted-printable Reviewed-by: Nate DeSimone -----Original Message----- From: Kubacki, Michael A =20 Sent: Tuesday, November 12, 2019 8:38 PM To: devel@edk2.groups.io Cc: Bi, Dandan ; Chaganty, Rangasai V ; Dong, Eric ; Desimone, Nathaniel L ; Gao, Liming Subject: [edk2-platforms][PATCH V1 43/49] Platform/Intel/Readme.md Content = update Updates the advanced feature location referenced in Readme.md to edk2-platf= orms/Features/Intel. Cc: Dandan Bi Cc: Sai Chaganty Cc: Eric Dong Cc: Nate DeSimone Cc: Liming Gao Signed-off-by: Michael Kubacki --- Platform/Intel/Readme.md | 14 +++++++------- 1 file changed, 7 insertions(+), 7 deletions(-) diff --git a/Platform/Intel/Readme.md b/Platform/Intel/Readme.md index 0f86= 978fee..02d9517d19 100644 --- a/Platform/Intel/Readme.md +++ b/Platform/Intel/Readme.md @@ -89,8 +89,7 @@ A UEFI firmware implementation using MinPlatformPkg is co= nstructed using the fol The board package follows the standard EDK II pack= age structure with the following additional elements and guidelines: * Only code usable across more than one board at the root level. * Board-specific code in a directory. The directory name should match that= of the board supported. -* Features not essential to achieve stage 5 or earlier boots are maintaine= d in a Features folder at the appropriate - level in the package hierarchy. +* Features not essential to achieve stage 5 or earlier boots are maintaine= d in edk2-platforms/Features/Intel. =20 Shared resources in the package root directory can include interfaces desc= ribed in header files, library instances, firmware modules, binaries, etc.= The UEFI firmware implementation is built using the process described belo= w from the @@ -260,16 +259,17 @@ return back to the minimum platform caller= . =20 ### **Package Builds** =20 -In some cases, such as AdvancedFeaturePkg, a package may provide a set of = functionality that is included in other +In some cases, such as BoardModulePkg, a package may provide a set of=20 +functionality that is included in other packages. To test the build of the whole package, the "build" command shou= ld be used following the instructions below. =20 1. Execute edksetup.bat (Windows) or edksetup.sh (Linux). 2. Verify the "WORKSPACE" environment variable is set to the edk2 director= y in your workspace. -3. Set the "PACKAGES_PATH" environment variable to include the edk2-platfo= rms/Platform/Intel and edk2-platforms/Silicon/Intel - directories. - * Windows example: set PACKAGES_PATH=3Dc:\Edk2Workspace\edk2-platforms\= Platform\Intel;c:\Edk2Workspace\edk2-platforms\Silicon\Intel +3. Set the "PACKAGES_PATH" environment variable to include the edk2-platfo= rms/Platform/Intel, edk2-platforms/Silicon/Intel, + and edk2-platforms/Features/Intel directories. + * Windows example: set PACKAGES_PATH=3Dc:\Edk2Workspace\edk2-platforms\= Platform\Intel; + =20 +c:\Edk2Workspace\edk2-platforms\Silicon\Intel;c:\Edk2Workspace\edk2-pla +tforms\Features\Intel 4. Build the package by specifying the package DSC as the platform build t= arget from the Platform/Intel or Silicon/Intel directory: - "build -p AdvancedFeaturePkg/AdvancedFeaturePkg.dsc" + "build -p BoardModulePkg/BoardModulePkg.dsc -a IA32 -a X64" =20 =20 ### **Firmware Image Flashing** -- 2.16.2.windows.1