From mboxrd@z Thu Jan 1 00:00:00 1970 Received: from mga11.intel.com (mga11.intel.com [192.55.52.93]) by mx.groups.io with SMTP id smtpd.web09.427.1575417451240107991 for ; Tue, 03 Dec 2019 15:57:31 -0800 Authentication-Results: mx.groups.io; dkim=missing; spf=pass (domain: intel.com, ip: 192.55.52.93, mailfrom: nathaniel.l.desimone@intel.com) X-Amp-Result: SKIPPED(no attachment in message) X-Amp-File-Uploaded: False Received: from orsmga007.jf.intel.com ([10.7.209.58]) by fmsmga102.fm.intel.com with ESMTP/TLS/DHE-RSA-AES256-GCM-SHA384; 03 Dec 2019 15:57:30 -0800 X-ExtLoop1: 1 X-IronPort-AV: E=Sophos;i="5.69,275,1571727600"; d="scan'208";a="201192525" Received: from orsmsx109.amr.corp.intel.com ([10.22.240.7]) by orsmga007.jf.intel.com with ESMTP; 03 Dec 2019 15:57:30 -0800 Received: from orsmsx156.amr.corp.intel.com (10.22.240.22) by ORSMSX109.amr.corp.intel.com (10.22.240.7) with Microsoft SMTP Server (TLS) id 14.3.439.0; Tue, 3 Dec 2019 15:57:29 -0800 Received: from orsmsx114.amr.corp.intel.com ([169.254.8.67]) by ORSMSX156.amr.corp.intel.com ([169.254.8.168]) with mapi id 14.03.0439.000; Tue, 3 Dec 2019 15:57:29 -0800 From: "Nate DeSimone" To: "devel@edk2.groups.io" , "Kubacki, Michael A" CC: "Chaganty, Rangasai V" , "Gao, Liming" Subject: Re: [edk2-devel] [edk2-platforms][PATCH V2 12/47] Features/Intel/S3FeaturePkg: Add initial package Thread-Topic: [edk2-devel] [edk2-platforms][PATCH V2 12/47] Features/Intel/S3FeaturePkg: Add initial package Thread-Index: AQHVpYg8C2dRgRCeukaxr5ZtRQ0NU6epHwNA Date: Tue, 3 Dec 2019 23:57:28 +0000 Message-ID: <02A34F284D1DA44BB705E61F7180EF0AB5C13DDD@ORSMSX114.amr.corp.intel.com> References: <20191128010614.43628-1-michael.a.kubacki@intel.com> <20191128010614.43628-13-michael.a.kubacki@intel.com> In-Reply-To: <20191128010614.43628-13-michael.a.kubacki@intel.com> Accept-Language: en-US X-MS-Has-Attach: X-MS-TNEF-Correlator: dlp-product: dlpe-windows dlp-version: 11.2.0.6 dlp-reaction: no-action x-titus-metadata-40: eyJDYXRlZ29yeUxhYmVscyI6IiIsIk1ldGFkYXRhIjp7Im5zIjoiaHR0cDpcL1wvd3d3LnRpdHVzLmNvbVwvbnNcL0ludGVsMyIsImlkIjoiMjU3MmQ5NjAtYTVkOC00MjFiLThmYTktNTJkZmQzZjAyZTE3IiwicHJvcHMiOlt7Im4iOiJDVFBDbGFzc2lmaWNhdGlvbiIsInZhbHMiOlt7InZhbHVlIjoiQ1RQX05UIn1dfV19LCJTdWJqZWN0TGFiZWxzIjpbXSwiVE1DVmVyc2lvbiI6IjE3LjEwLjE4MDQuNDkiLCJUcnVzdGVkTGFiZWxIYXNoIjoib1wvWlpYQTUwVHB0QVhwMko3VGFMY0VoQTlhZUJ3anAzRE9DRzZJYk5Zbjh4U2toNHdGZEt5dGZEaTlDWVZLc0oifQ== x-ctpclassification: CTP_NT x-originating-ip: [10.22.254.138] MIME-Version: 1.0 Return-Path: nathaniel.l.desimone@intel.com Content-Language: en-US Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: quoted-printable Reviewed-by: Nate DeSimone -----Original Message----- From: devel@edk2.groups.io On Behalf Of Kubacki, Mi= chael A Sent: Wednesday, November 27, 2019 5:06 PM To: devel@edk2.groups.io Cc: Chaganty, Rangasai V ; Gao, Liming Subject: [edk2-devel] [edk2-platforms][PATCH V2 12/47] Features/Intel/S3Fe= aturePkg: Add initial package Adds a new feature package for the S3 feature. Cc: Sai Chaganty Cc: Liming Gao Signed-off-by: Michael Kubacki --- Features/Intel/PowerManagement/S3FeaturePkg/S3FeaturePkg.dec | 30 = +++++ Features/Intel/PowerManagement/S3FeaturePkg/Include/S3Feature.dsc | 122 = ++++++++++++++++++++ Features/Intel/PowerManagement/S3FeaturePkg/S3FeaturePkg.dsc | 30 = +++++ Features/Intel/PowerManagement/S3FeaturePkg/Include/PostMemory.fdf | 8 = ++ Features/Intel/PowerManagement/S3FeaturePkg/Include/PreMemory.fdf | 10 = ++ Features/Intel/PowerManagement/S3FeaturePkg/S3Pei/S3Pei.inf | 35 = ++++++ Features/Intel/PowerManagement/S3FeaturePkg/S3Pei/S3Pei.c | 36 = ++++++ Features/Intel/PowerManagement/S3FeaturePkg/Readme.md | 94 = +++++++++++++++ 8 files changed, 365 insertions(+) diff --git a/Features/Intel/PowerManagement/S3FeaturePkg/S3FeaturePkg.dec = b/Features/Intel/PowerManagement/S3FeaturePkg/S3FeaturePkg.dec new file mode 100644 index 0000000000..2a723ad3d6 --- /dev/null +++ b/Features/Intel/PowerManagement/S3FeaturePkg/S3FeaturePkg.dec @@ -0,0 +1,30 @@ +## @file +# This package provides advanced feature functionality for S3 support. +# This package should only depend on EDK II Core packages, IntelSiliconPk= g, and MinPlatformPkg. +# +# The DEC files are used by the utilities that parse DSC and # INF=20 +files to generate AutoGen.c and AutoGen.h files # for the build=20 +infrastructure. +# +# Copyright (c) 2019, Intel Corporation. All rights reserved.
# #=20 +SPDX-License-Identifier: BSD-2-Clause-Patent # ## + +[Defines] + DEC_SPECIFICATION =3D 0x00010017 + PACKAGE_NAME =3D S3FeaturePkg + PACKAGE_GUID =3D 600F7249-65BD-44E2-80D7-344BD5250198 + PACKAGE_VERSION =3D 0.1 + +[Includes] + Include + +[LibraryClasses] + +[Guids] + gS3FeaturePkgTokenSpaceGuid =3D {0x423c5a51, 0x36e9, 0x4aea, {0x92,= =20 +0xdd, 0xdd, 0xae, 0x5b, 0x4a, 0x3d, 0x24}} + +[PcdsFeatureFlag] + +gS3FeaturePkgTokenSpaceGuid.PcdS3FeatureEnable|FALSE|BOOLEAN|0xA0000001 diff --git a/Features/Intel/PowerManagement/S3FeaturePkg/Include/S3Feature= .dsc b/Features/Intel/PowerManagement/S3FeaturePkg/Include/S3Feature.dsc new file mode 100644 index 0000000000..647dc3f93a --- /dev/null +++ b/Features/Intel/PowerManagement/S3FeaturePkg/Include/S3Feature.dsc @@ -0,0 +1,122 @@ +## @file +# This is a build description file for the S3 advanced feature. +# This file should be included into another package DSC file to build thi= s feature. +# +# The DEC files are used by the utilities that parse DSC and # INF=20 +files to generate AutoGen.c and AutoGen.h files # for the build=20 +infrastructure. +# +# Copyright (c) 2019, Intel Corporation. All rights reserved.
# #=20 +SPDX-License-Identifier: BSD-2-Clause-Patent # ## + +####################################################################### +######### +# +# Defines Section - statements that will be processed to create a Makefil= e. +# +####################################################################### +######### +[Defines] +!ifndef $(PEI_ARCH) + !error "PEI_ARCH must be specified to build this feature!" +!endif +!ifndef $(DXE_ARCH) + !error "DXE_ARCH must be specified to build this feature!" +!endif + +####################################################################### +######### +# +# Library Class section - list of all Library Classes needed by this feat= ure. +# +####################################################################### +######### +[LibraryClasses] + ####################################### + # Edk2 Packages + ####################################### + BaseLib|MdePkg/Library/BaseLib/BaseLib.inf + +BaseMemoryLib|MdePkg/Library/BaseMemoryLibRepStr/BaseMemoryLibRepStr.in +f + DebugLib|MdePkg/Library/BaseDebugLibNull/BaseDebugLibNull.inf + IoLib|MdePkg/Library/BaseIoLibIntrinsic/BaseIoLibIntrinsic.inf + PciCf8Lib|MdePkg/Library/BasePciCf8Lib/BasePciCf8Lib.inf + PciLib|MdePkg/Library/BasePciLibCf8/BasePciLibCf8.inf + +PciSegmentLib|MdePkg/Library/BasePciSegmentLibPci/BasePciSegmentLibPci. +inf + +[LibraryClasses.common.PEI_CORE,LibraryClasses.common.PEIM] + ####################################### + # Edk2 Packages + ####################################### + HobLib|MdePkg/Library/PeiHobLib/PeiHobLib.inf + +MemoryAllocationLib|MdePkg/Library/PeiMemoryAllocationLib/PeiMemoryAllo +cationLib.inf + PcdLib|MdePkg/Library/PeiPcdLib/PeiPcdLib.inf + PeimEntryPoint|MdePkg/Library/PeimEntryPoint/PeimEntryPoint.inf + PeiServicesLib|MdePkg/Library/PeiServicesLib/PeiServicesLib.inf + +PeiServicesTablePointerLib|MdePkg/Library/PeiServicesTablePointerLibIdt +/PeiServicesTablePointerLibIdt.inf + + ####################################### + # Silicon Initialization Package + ####################################### + + SmmAccessLib|IntelSiliconPkg/Feature/SmmAccess/Library/PeiSmmAccessLib + /PeiSmmAccessLib.inf + +####################################################################### +######### +# +# Component section - list of all components that need built for this fea= ture. +# +# Note: The EDK II DSC file is not used to specify how compiled binary im= ages get placed +# into firmware volume images. This section is just a list of modul= es to compile from +# source into UEFI-compliant binaries. +# It is the FDF file that contains information on combining binary = files into firmware +# volume images, whose concept is beyond UEFI and is described in P= I specification. +# There may also be modules listed in this section that are not req= uired in the FDF file, +# When a module listed here is excluded from FDF file, then UEFI-co= mpliant binary will be +# generated for it, but the binary will not be put into any firmwar= e volume. +# +####################################################################### +######### + +# +# Feature PEI Components +# + +# @todo: Change below line to [Components.$(PEI_ARCH)] after https://bugz= illa.tianocore.org/show_bug.cgi?id=3D2308 +# is completed. +[Components.IA32] + ##################################### + # S3 Feature Package + ##################################### + + # Add library instances here that are not included in package=20 + components and should be tested # in the package build. + + # Add components here that should be included in the package build. + PowerManagement/S3FeaturePkg/S3Pei/S3Pei.inf + +# +# Feature DXE Components +# + +# @todo: Change below line to [Components.$(DXE_ARCH)] after https://bugz= illa.tianocore.org/show_bug.cgi?id=3D2308 +# is completed. +[Components.X64] + ##################################### + # S3 Feature Package + ##################################### + + # Add library instances here that are not included in package=20 + components and should be tested # in the package build. + + # Add components here that should be included in the package build. + +####################################################################### +############################ +# +# BuildOptions Section - Define the module specific tool chain flags that= should be used as +# the default flags for a module. These flags are = appended to any +# standard flags that are defined by the build pro= cess. They can be +# applied for any modules or only those modules wi= th the specific +# module style (EDK or EDKII) specified in [Compon= ents] section. +# +# For advanced features, it is recommended to enab= le [BuildOptions] in +# the applicable INF file so it does not affect th= e whole board package +# build when this DSC file is active. +# +####################################################################### +############################ +[BuildOptions] diff --git a/Features/Intel/PowerManagement/S3FeaturePkg/S3FeaturePkg.dsc = b/Features/Intel/PowerManagement/S3FeaturePkg/S3FeaturePkg.dsc new file mode 100644 index 0000000000..28ee49d429 --- /dev/null +++ b/Features/Intel/PowerManagement/S3FeaturePkg/S3FeaturePkg.dsc @@ -0,0 +1,30 @@ +## @file +# This package provides advanced feature functionality for S3 support. +# This package should only depend on EDK II Core packages, IntelSiliconPk= g, and MinPlatformPkg. +# +# The DEC files are used by the utilities that parse DSC and # INF=20 +files to generate AutoGen.c and AutoGen.h files # for the build=20 +infrastructure. +# +# Copyright (c) 2019, Intel Corporation. All rights reserved.
# #=20 +SPDX-License-Identifier: BSD-2-Clause-Patent # ## + +[Defines] + PLATFORM_NAME =3D S3FeaturePkg + PLATFORM_GUID =3D 02E7C519-5A24-4594-8D69-F4117D6E3D25 + PLATFORM_VERSION =3D 0.1 + DSC_SPECIFICATION =3D 0x00010005 + OUTPUT_DIRECTORY =3D Build/$(PLATFORM_NAME) + SUPPORTED_ARCHITECTURES =3D IA32|X64 + BUILD_TARGETS =3D DEBUG|RELEASE|NOOPT + SKUID_IDENTIFIER =3D DEFAULT + PEI_ARCH =3D IA32 + DXE_ARCH =3D X64 + +# +# This package always builds the feature. +# +!include Include/S3Feature.dsc diff --git a/Features/Intel/PowerManagement/S3FeaturePkg/Include/PostMemor= y.fdf b/Features/Intel/PowerManagement/S3FeaturePkg/Include/PostMemory.fdf new file mode 100644 index 0000000000..9e17f853c6 --- /dev/null +++ b/Features/Intel/PowerManagement/S3FeaturePkg/Include/PostMemory.fdf @@ -0,0 +1,8 @@ +## @file +# FDF file for post-memory S3 advanced feature modules. +# +# Copyright (c) 2019, Intel Corporation. All rights reserved.
# #=20 +SPDX-License-Identifier: BSD-2-Clause-Patent # ## diff --git a/Features/Intel/PowerManagement/S3FeaturePkg/Include/PreMemory= .fdf b/Features/Intel/PowerManagement/S3FeaturePkg/Include/PreMemory.fdf new file mode 100644 index 0000000000..3cd5cd9628 --- /dev/null +++ b/Features/Intel/PowerManagement/S3FeaturePkg/Include/PreMemory.fdf @@ -0,0 +1,10 @@ +## @file +# FDF file for pre-memory S3 advanced feature modules. +# +# Copyright (c) 2019, Intel Corporation. All rights reserved.
# #=20 +SPDX-License-Identifier: BSD-2-Clause-Patent # ## + + INF PowerManagement/S3FeaturePkg/S3Pei/S3Pei.inf diff --git a/Features/Intel/PowerManagement/S3FeaturePkg/S3Pei/S3Pei.inf b= /Features/Intel/PowerManagement/S3FeaturePkg/S3Pei/S3Pei.inf new file mode 100644 index 0000000000..46fbb62a46 --- /dev/null +++ b/Features/Intel/PowerManagement/S3FeaturePkg/S3Pei/S3Pei.inf @@ -0,0 +1,35 @@ +### @file +# Component information file for the S3 PEI module. +# +# Copyright (c) 2019, Intel Corporation. All rights reserved.
# #=20 +SPDX-License-Identifier: BSD-2-Clause-Patent # ### + +[Defines] + INF_VERSION =3D 0x00010017 + BASE_NAME =3D S3Pei + FILE_GUID =3D 8683EFB2-FDE1-4AFF-B2DB-E96449FDD4E9 + VERSION_STRING =3D 1.0 + MODULE_TYPE =3D PEIM + ENTRY_POINT =3D S3PeiEntryPoint + +[LibraryClasses] + PeimEntryPoint + PeiServicesLib + SmmAccessLib + +[Packages] + MdePkg/MdePkg.dec + IntelSiliconPkg/IntelSiliconPkg.dec + PowerManagement/S3FeaturePkg/S3FeaturePkg.dec + +[Sources] + S3Pei.c + +[FeaturePcd] + gS3FeaturePkgTokenSpaceGuid.PcdS3FeatureEnable + +[Depex] + gEfiPeiMemoryDiscoveredPpiGuid diff --git a/Features/Intel/PowerManagement/S3FeaturePkg/S3Pei/S3Pei.c b/F= eatures/Intel/PowerManagement/S3FeaturePkg/S3Pei/S3Pei.c new file mode 100644 index 0000000000..b0aaa04962 --- /dev/null +++ b/Features/Intel/PowerManagement/S3FeaturePkg/S3Pei/S3Pei.c @@ -0,0 +1,36 @@ +/** @file + Source code file for S3 PEI module + +Copyright (c) 2019, Intel Corporation. All rights reserved.
+SPDX-License-Identifier: BSD-2-Clause-Patent + +**/ + +#include +#include + +/** + S3 PEI module entry point + + @param[in] FileHandle Not used. + @param[in] PeiServices General purpose services available to = every PEIM. + + @retval EFI_SUCCESS The function completes successfully + @retval EFI_OUT_OF_RESOURCES Insufficient resources to create datab= ase +**/ +EFI_STATUS +EFIAPI +S3PeiEntryPoint ( + IN EFI_PEI_FILE_HANDLE FileHandle, + IN CONST EFI_PEI_SERVICES **PeiServices + ) +{ + EFI_STATUS Status; + + // + // Install EFI_PEI_MM_ACCESS_PPI for S3 resume case // Status =3D=20 + PeiInstallSmmAccessPpi (); + + return Status; +} diff --git a/Features/Intel/PowerManagement/S3FeaturePkg/Readme.md b/Featu= res/Intel/PowerManagement/S3FeaturePkg/Readme.md new file mode 100644 index 0000000000..f9b60b3f0c --- /dev/null +++ b/Features/Intel/PowerManagement/S3FeaturePkg/Readme.md @@ -0,0 +1,94 @@ +# Overview +* **Feature Name:** S3 +* **PI Phase(s) Supported:** PEI +* **SMM Required?** Yes + +More Information: +* [A Tour Beyond BIOS - Implementing S3 Resume with EDK=20 +II](https://github.com/tianocore-docs/Docs/raw/master/White_Papers/A_To +ur_Beyond_BIOS_Implementing_S3_resume_with_EDKII_V2.pdf) +* [UEFI ACPI & Platform Initialization (PI=20 +Specification)](https://uefi.org/specifications) + +## Purpose +The S3 feature provides the set of firmware resources and board=20 +enabling instructions to enable S3 firmware feature support in a board=20 +package. S3 resume is a power saving feature defined in the Advanced=20 +Configuration and Power Interface (ACPI) specification. The ACPI specific= ation defines a set of power state transitions. In the context of this feat= ure, S3 refers to the G1 sleeping - S3 sleeping state. + +**Note: The S3 feature is currently not complete. Additional=20 +functionality will be enabled in the future.** + +# High-Level Theory of Operation +*_TODO_* +A description of how the device works at a high-level. + +The description should not be constrained to implementation details but= =20 +provide a simple mental model of how the feature is supposed to work. + +## Firmware Volumes +*_TODO_* +A bulleted list of the firmware volumes that feature module(s) are placed= in. + +## Modules +*_TODO_* +A bulleted list of the modules that make up the feature. + +## +*_TODO_* +Each module in the feature should have a section that describes the=20 +module in a level of detail that is useful to better understand the modul= e source code. + +## +*_TODO_* +Each library in the feature should have a section that describes the=20 +library in a level of detail that is useful to better understand the libr= ary source code. + +## Key Functions +*_TODO_* +A bulleted list of key functions for interacting with the feature. + +Not all features need to be listed. Only functions exposed through=20 +external interfaces that are important for feature users to be aware of. + +## Configuration +*_TODO_* +Information that is useful for configuring the feature. + +Not all configuration options need to be listed. This section is used=20 +to provide more background on configuration options than possible elsewhe= re. + +## Data Flows +*_TODO_* +Architecturally defined data structures and flows for the feature. + +## Control Flows +*_TODO_* +Key control flows for the feature. + +## Build Flows +*_TODO_* +Any special build flows should be described in this section. + +This is particularly useful for features that use custom build tools or= =20 +require non-standard tool configuration. If the standard flow in the feat= ure package template is used, this section may be empty. + +## Test Point Results +*_TODO_* +The test(s) that can verify porting is complete for the feature. + +Each feature must describe at least one test point to verify the=20 +feature is successful. If the test point is not implemented, this should = be stated. + +## Functional Exit Criteria +*_TODO_* +The testable functionality for the feature. + +This section should provide an ordered list of criteria that a board=20 +integrator can reference to ensure the feature is functional on their boa= rd. + +## Feature Enabling Checklist +*_TODO_* +An ordered list of required activities to achieve desired functionality f= or the feature. + +## Common Optimizations +*_TODO_* +Common size or performance tuning options for this feature. + +This section is recommended but not required. If not used, the contents s= hould be left empty. -- 2.16.2.windows.1