Re: [PATCH 0/6] fix top-level package builds for AARCH64/ARM

[Leif Lindholm <leif.lindholm@linaro.org>]

Hmm, I kind of dropped the ball on this set, waiting for feedback on
the reworked version of 1/6.

In the meantime, Ard submitted an identical fix for 4/6
"MdeModulePkg: drop DebugSupportDxe from AARCH64 components" which got
merged as fc27682813
("MdeModulePkg/MdeModulePkg/dsc: move DxeDebugSupportDxe to x86 only section")

Since I now have R-b for the set, I have just pushed the remaining 5
as 6c61ec4c62..3b6c73f13e.

On Thu, Nov 01, 2018 at 03:36:36PM +0000, Leif Lindholm wrote:
> Most of the top-level packages should be buildable for all architectures
> Here is a fairly trivial set that makes that happen.
> 
> Leif Lindholm (6):
>   AppPkg: fix webserver build for !Ia32/X64
>   IntelFrameworkModulePkg: fix build for AARCH64/ARM
>   IntelFrameworkPkg: fix build for AARCH64/ARM
>   MdeModulePkg: drop DebugSupportDxe from AARCH64 components
>   SecurityPkg: fix package build on ARM
>   SignedCapsulePkg: enable package build for AARCH64/ARM
> 
> Cc: Daryl McDaniel <edk2-lists@mc2research.org>
> Cc: Jaben Carsey <jaben.carsey@intel.com>
> Cc: Liming Gao <liming.gao@intel.com>
> Cc: Michael D Kinney <michael.d.kinney@intel.com>
> Cc: Liming Gao <liming.gao@intel.com>
> Cc: Star Zeng <star.zeng@intel.com>
> Cc: Jian J Wang <jian.j.wang@intel.com>
> Cc: Chao Zhang <chao.b.zhang@intel.com>
> Cc: Jiewen Yao <jiewen.yao@intel.com>
> 
>  IntelFrameworkModulePkg/IntelFrameworkModulePkg.dsc | 13 ++++++++++++-
>  IntelFrameworkPkg/IntelFrameworkPkg.dsc             |  2 +-
>  MdeModulePkg/MdeModulePkg.dsc                       |  2 +-
>  SecurityPkg/SecurityPkg.dsc                         | 11 +++++++++++
>  SignedCapsulePkg/SignedCapsulePkg.dsc               | 15 ++++++++++++++-
>  AppPkg/Applications/Sockets/WebServer/WebServer.h   |  2 ++
>  6 files changed, 41 insertions(+), 4 deletions(-)
> 
> -- 
> 2.11.0
>