From mboxrd@z Thu Jan 1 00:00:00 1970 Authentication-Results: mx.groups.io; dkim=missing; spf=fail (domain: intel.com, ip: , mailfrom: eric.dong@intel.com) Received: from mga03.intel.com (mga03.intel.com []) by groups.io with SMTP; Sun, 26 May 2019 18:12:53 -0700 X-Amp-Result: SKIPPED(no attachment in message) X-Amp-File-Uploaded: False Received: from fmsmga003.fm.intel.com ([10.253.24.29]) by orsmga103.jf.intel.com with ESMTP/TLS/DHE-RSA-AES256-GCM-SHA384; 26 May 2019 18:12:52 -0700 X-ExtLoop1: 1 Received: from ydong10-win10.ccr.corp.intel.com ([10.239.158.133]) by FMSMGA003.fm.intel.com with ESMTP; 26 May 2019 18:12:51 -0700 From: "Dong, Eric" To: devel@edk2.groups.io Cc: Liming Gao , Michael Kubacki , Sai Chaganty , Oram, Isaac W Subject: [Patch 1/3] [edk2-platform] Maintainers.txt: Add BoardModulePkg in Platform/Intel/ folder. Date: Mon, 27 May 2019 09:12:39 +0800 Message-Id: <20190527011241.14916-2-eric.dong@intel.com> X-Mailer: git-send-email 2.21.0.windows.1 In-Reply-To: <20190527011241.14916-1-eric.dong@intel.com> References: <20190527011241.14916-1-eric.dong@intel.com> MIME-Version: 1.0 Content-Transfer-Encoding: 8bit Add new package BoardModulePkg which used to keep the modules which is generic for all board. Signed-off-by: Eric Dong Cc: Liming Gao Cc: Michael Kubacki Cc: Sai Chaganty Cc: Oram, Isaac W --- Maintainers.txt | 4 +++ .../Intel/BoardModulePkg/BoardModulePkg.dec | 26 +++++++++++++++++++ 2 files changed, 30 insertions(+) create mode 100644 Platform/Intel/BoardModulePkg/BoardModulePkg.dec diff --git a/Maintainers.txt b/Maintainers.txt index 76feecceb7..2bc4a6c1ca 100644 --- a/Maintainers.txt +++ b/Maintainers.txt @@ -60,6 +60,10 @@ M: Michael Kubacki M: Sai Chaganty R: Liming Gao +Platform/Intel/BoardModulePkg +M: Eric Dong +R: Liming Gao + Platform/Intel/ClevoOpenBoardPkg M: Michael Kubacki M: Ankit Sinha diff --git a/Platform/Intel/BoardModulePkg/BoardModulePkg.dec b/Platform/Intel/BoardModulePkg/BoardModulePkg.dec new file mode 100644 index 0000000000..94de8989c4 --- /dev/null +++ b/Platform/Intel/BoardModulePkg/BoardModulePkg.dec @@ -0,0 +1,26 @@ +## @file +# This package provides the modules that build for a full feature platform. +# This AdvancedFeaturePkg should only depend on EDKII Core packages and MinPlatformPkg. +# +# The DEC files are used by the utilities that parse DSC and +# INF files to generate AutoGen.c and AutoGen.h files +# for the build infrastructure. +# +# Copyright (c) 2019, Intel Corporation. All rights reserved.
+# +# SPDX-License-Identifier: BSD-2-Clause-Patent +# +## + + +[Defines] + DEC_SPECIFICATION = 0x00010017 + PACKAGE_NAME = BoardModulePkg + PACKAGE_VERSION = 0.1 + PACKAGE_GUID = 30EEB750-574D-45AA-8895-D77161019BC7 + + +[Includes] + + +[LibraryClasses] -- 2.21.0.windows.1