From mboxrd@z Thu Jan 1 00:00:00 1970 Received: from mga11.intel.com (mga11.intel.com []) by mx.groups.io with SMTP id smtpd.web10.2401.1573615709373949821 for ; Tue, 12 Nov 2019 19:29:13 -0800 Authentication-Results: mx.groups.io; dkim=missing; spf=fail (domain: intel.com, ip: , mailfrom: michael.a.kubacki@intel.com) X-Amp-Result: SKIPPED(no attachment in message) X-Amp-File-Uploaded: False Received: from orsmga005.jf.intel.com ([10.7.209.41]) by fmsmga102.fm.intel.com with ESMTP/TLS/DHE-RSA-AES256-GCM-SHA384; 12 Nov 2019 19:29:12 -0800 X-ExtLoop1: 1 X-IronPort-AV: E=Sophos;i="5.68,299,1569308400"; d="scan'208";a="379090922" Received: from makuback-desk1.amr.corp.intel.com ([10.7.159.162]) by orsmga005.jf.intel.com with ESMTP; 12 Nov 2019 19:29:12 -0800 From: "Kubacki, Michael A" To: devel@edk2.groups.io Cc: Sai Chaganty , Liming Gao Subject: [edk2-platforms][PATCH V1 14/49] Features/Intel: Add S3FeaturePkg Date: Tue, 12 Nov 2019 19:27:40 -0800 Message-Id: <20191113032816.4056-15-michael.a.kubacki@intel.com> X-Mailer: git-send-email 2.16.2.windows.1 In-Reply-To: <20191113032816.4056-1-michael.a.kubacki@intel.com> References: <20191113032816.4056-1-michael.a.kubacki@intel.com> Adds a new feature package for the S3 feature. Cc: Sai Chaganty Cc: Liming Gao Signed-off-by: Michael Kubacki --- Features/Intel/PowerManagement/S3FeaturePkg/S3FeaturePkg.dec | 30 +++++ Features/Intel/PowerManagement/S3FeaturePkg/Include/S3Feature.dsc | 122 ++++++++++++++++++++ Features/Intel/PowerManagement/S3FeaturePkg/S3FeaturePkg.dsc | 30 +++++ Features/Intel/PowerManagement/S3FeaturePkg/Include/PostMemory.fdf | 8 ++ Features/Intel/PowerManagement/S3FeaturePkg/Include/PreMemory.fdf | 10 ++ Features/Intel/PowerManagement/S3FeaturePkg/S3Pei/S3Pei.inf | 35 ++++++ Features/Intel/PowerManagement/S3FeaturePkg/S3Pei/S3Pei.c | 36 ++++++ Features/Intel/PowerManagement/S3FeaturePkg/Readme.md | 86 ++++++++++++++ 8 files changed, 357 insertions(+) diff --git a/Features/Intel/PowerManagement/S3FeaturePkg/S3FeaturePkg.dec b/Features/Intel/PowerManagement/S3FeaturePkg/S3FeaturePkg.dec new file mode 100644 index 0000000000..2a723ad3d6 --- /dev/null +++ b/Features/Intel/PowerManagement/S3FeaturePkg/S3FeaturePkg.dec @@ -0,0 +1,30 @@ +## @file +# This package provides advanced feature functionality for S3 support. +# This package should only depend on EDK II Core packages, IntelSiliconPkg, and MinPlatformPkg. +# +# The DEC files are used by the utilities that parse DSC and +# INF files to generate AutoGen.c and AutoGen.h files +# for the build infrastructure. +# +# Copyright (c) 2019, Intel Corporation. All rights reserved.
+# +# SPDX-License-Identifier: BSD-2-Clause-Patent +# +## + +[Defines] + DEC_SPECIFICATION = 0x00010017 + PACKAGE_NAME = S3FeaturePkg + PACKAGE_GUID = 600F7249-65BD-44E2-80D7-344BD5250198 + PACKAGE_VERSION = 0.1 + +[Includes] + Include + +[LibraryClasses] + +[Guids] + gS3FeaturePkgTokenSpaceGuid = {0x423c5a51, 0x36e9, 0x4aea, {0x92, 0xdd, 0xdd, 0xae, 0x5b, 0x4a, 0x3d, 0x24}} + +[PcdsFeatureFlag] + gS3FeaturePkgTokenSpaceGuid.PcdS3FeatureEnable|FALSE|BOOLEAN|0xA0000001 diff --git a/Features/Intel/PowerManagement/S3FeaturePkg/Include/S3Feature.dsc b/Features/Intel/PowerManagement/S3FeaturePkg/Include/S3Feature.dsc new file mode 100644 index 0000000000..647dc3f93a --- /dev/null +++ b/Features/Intel/PowerManagement/S3FeaturePkg/Include/S3Feature.dsc @@ -0,0 +1,122 @@ +## @file +# This is a build description file for the S3 advanced feature. +# This file should be included into another package DSC file to build this feature. +# +# The DEC files are used by the utilities that parse DSC and +# INF files to generate AutoGen.c and AutoGen.h files +# for the build infrastructure. +# +# Copyright (c) 2019, Intel Corporation. All rights reserved.
+# +# SPDX-License-Identifier: BSD-2-Clause-Patent +# +## + +################################################################################ +# +# Defines Section - statements that will be processed to create a Makefile. +# +################################################################################ +[Defines] +!ifndef $(PEI_ARCH) + !error "PEI_ARCH must be specified to build this feature!" +!endif +!ifndef $(DXE_ARCH) + !error "DXE_ARCH must be specified to build this feature!" +!endif + +################################################################################ +# +# Library Class section - list of all Library Classes needed by this feature. +# +################################################################################ +[LibraryClasses] + ####################################### + # Edk2 Packages + ####################################### + BaseLib|MdePkg/Library/BaseLib/BaseLib.inf + BaseMemoryLib|MdePkg/Library/BaseMemoryLibRepStr/BaseMemoryLibRepStr.inf + DebugLib|MdePkg/Library/BaseDebugLibNull/BaseDebugLibNull.inf + IoLib|MdePkg/Library/BaseIoLibIntrinsic/BaseIoLibIntrinsic.inf + PciCf8Lib|MdePkg/Library/BasePciCf8Lib/BasePciCf8Lib.inf + PciLib|MdePkg/Library/BasePciLibCf8/BasePciLibCf8.inf + PciSegmentLib|MdePkg/Library/BasePciSegmentLibPci/BasePciSegmentLibPci.inf + +[LibraryClasses.common.PEI_CORE,LibraryClasses.common.PEIM] + ####################################### + # Edk2 Packages + ####################################### + HobLib|MdePkg/Library/PeiHobLib/PeiHobLib.inf + MemoryAllocationLib|MdePkg/Library/PeiMemoryAllocationLib/PeiMemoryAllocationLib.inf + PcdLib|MdePkg/Library/PeiPcdLib/PeiPcdLib.inf + PeimEntryPoint|MdePkg/Library/PeimEntryPoint/PeimEntryPoint.inf + PeiServicesLib|MdePkg/Library/PeiServicesLib/PeiServicesLib.inf + PeiServicesTablePointerLib|MdePkg/Library/PeiServicesTablePointerLibIdt/PeiServicesTablePointerLibIdt.inf + + ####################################### + # Silicon Initialization Package + ####################################### + SmmAccessLib|IntelSiliconPkg/Feature/SmmAccess/Library/PeiSmmAccessLib/PeiSmmAccessLib.inf + +################################################################################ +# +# Component section - list of all components that need built for this feature. +# +# Note: The EDK II DSC file is not used to specify how compiled binary images get placed +# into firmware volume images. This section is just a list of modules to compile from +# source into UEFI-compliant binaries. +# It is the FDF file that contains information on combining binary files into firmware +# volume images, whose concept is beyond UEFI and is described in PI specification. +# There may also be modules listed in this section that are not required in the FDF file, +# When a module listed here is excluded from FDF file, then UEFI-compliant binary will be +# generated for it, but the binary will not be put into any firmware volume. +# +################################################################################ + +# +# Feature PEI Components +# + +# @todo: Change below line to [Components.$(PEI_ARCH)] after https://bugzilla.tianocore.org/show_bug.cgi?id=2308 +# is completed. +[Components.IA32] + ##################################### + # S3 Feature Package + ##################################### + + # Add library instances here that are not included in package components and should be tested + # in the package build. + + # Add components here that should be included in the package build. + PowerManagement/S3FeaturePkg/S3Pei/S3Pei.inf + +# +# Feature DXE Components +# + +# @todo: Change below line to [Components.$(DXE_ARCH)] after https://bugzilla.tianocore.org/show_bug.cgi?id=2308 +# is completed. +[Components.X64] + ##################################### + # S3 Feature Package + ##################################### + + # Add library instances here that are not included in package components and should be tested + # in the package build. + + # Add components here that should be included in the package build. + +################################################################################################### +# +# BuildOptions Section - Define the module specific tool chain flags that should be used as +# the default flags for a module. These flags are appended to any +# standard flags that are defined by the build process. They can be +# applied for any modules or only those modules with the specific +# module style (EDK or EDKII) specified in [Components] section. +# +# For advanced features, it is recommended to enable [BuildOptions] in +# the applicable INF file so it does not affect the whole board package +# build when this DSC file is active. +# +################################################################################################### +[BuildOptions] diff --git a/Features/Intel/PowerManagement/S3FeaturePkg/S3FeaturePkg.dsc b/Features/Intel/PowerManagement/S3FeaturePkg/S3FeaturePkg.dsc new file mode 100644 index 0000000000..28ee49d429 --- /dev/null +++ b/Features/Intel/PowerManagement/S3FeaturePkg/S3FeaturePkg.dsc @@ -0,0 +1,30 @@ +## @file +# This package provides advanced feature functionality for S3 support. +# This package should only depend on EDK II Core packages, IntelSiliconPkg, and MinPlatformPkg. +# +# The DEC files are used by the utilities that parse DSC and +# INF files to generate AutoGen.c and AutoGen.h files +# for the build infrastructure. +# +# Copyright (c) 2019, Intel Corporation. All rights reserved.
+# +# SPDX-License-Identifier: BSD-2-Clause-Patent +# +## + +[Defines] + PLATFORM_NAME = S3FeaturePkg + PLATFORM_GUID = 02E7C519-5A24-4594-8D69-F4117D6E3D25 + PLATFORM_VERSION = 0.1 + DSC_SPECIFICATION = 0x00010005 + OUTPUT_DIRECTORY = Build/$(PLATFORM_NAME) + SUPPORTED_ARCHITECTURES = IA32|X64 + BUILD_TARGETS = DEBUG|RELEASE|NOOPT + SKUID_IDENTIFIER = DEFAULT + PEI_ARCH = IA32 + DXE_ARCH = X64 + +# +# This package always builds the feature. +# +!include Include/S3Feature.dsc diff --git a/Features/Intel/PowerManagement/S3FeaturePkg/Include/PostMemory.fdf b/Features/Intel/PowerManagement/S3FeaturePkg/Include/PostMemory.fdf new file mode 100644 index 0000000000..9e17f853c6 --- /dev/null +++ b/Features/Intel/PowerManagement/S3FeaturePkg/Include/PostMemory.fdf @@ -0,0 +1,8 @@ +## @file +# FDF file for post-memory S3 advanced feature modules. +# +# Copyright (c) 2019, Intel Corporation. All rights reserved.
+# +# SPDX-License-Identifier: BSD-2-Clause-Patent +# +## diff --git a/Features/Intel/PowerManagement/S3FeaturePkg/Include/PreMemory.fdf b/Features/Intel/PowerManagement/S3FeaturePkg/Include/PreMemory.fdf new file mode 100644 index 0000000000..3cd5cd9628 --- /dev/null +++ b/Features/Intel/PowerManagement/S3FeaturePkg/Include/PreMemory.fdf @@ -0,0 +1,10 @@ +## @file +# FDF file for pre-memory S3 advanced feature modules. +# +# Copyright (c) 2019, Intel Corporation. All rights reserved.
+# +# SPDX-License-Identifier: BSD-2-Clause-Patent +# +## + + INF PowerManagement/S3FeaturePkg/S3Pei/S3Pei.inf diff --git a/Features/Intel/PowerManagement/S3FeaturePkg/S3Pei/S3Pei.inf b/Features/Intel/PowerManagement/S3FeaturePkg/S3Pei/S3Pei.inf new file mode 100644 index 0000000000..46fbb62a46 --- /dev/null +++ b/Features/Intel/PowerManagement/S3FeaturePkg/S3Pei/S3Pei.inf @@ -0,0 +1,35 @@ +### @file +# Component information file for the S3 PEI module. +# +# Copyright (c) 2019, Intel Corporation. All rights reserved.
+# +# SPDX-License-Identifier: BSD-2-Clause-Patent +# +### + +[Defines] + INF_VERSION = 0x00010017 + BASE_NAME = S3Pei + FILE_GUID = 8683EFB2-FDE1-4AFF-B2DB-E96449FDD4E9 + VERSION_STRING = 1.0 + MODULE_TYPE = PEIM + ENTRY_POINT = S3PeiEntryPoint + +[LibraryClasses] + PeimEntryPoint + PeiServicesLib + SmmAccessLib + +[Packages] + MdePkg/MdePkg.dec + IntelSiliconPkg/IntelSiliconPkg.dec + PowerManagement/S3FeaturePkg/S3FeaturePkg.dec + +[Sources] + S3Pei.c + +[FeaturePcd] + gS3FeaturePkgTokenSpaceGuid.PcdS3FeatureEnable + +[Depex] + gEfiPeiMemoryDiscoveredPpiGuid diff --git a/Features/Intel/PowerManagement/S3FeaturePkg/S3Pei/S3Pei.c b/Features/Intel/PowerManagement/S3FeaturePkg/S3Pei/S3Pei.c new file mode 100644 index 0000000000..b0aaa04962 --- /dev/null +++ b/Features/Intel/PowerManagement/S3FeaturePkg/S3Pei/S3Pei.c @@ -0,0 +1,36 @@ +/** @file + Source code file for S3 PEI module + +Copyright (c) 2019, Intel Corporation. All rights reserved.
+SPDX-License-Identifier: BSD-2-Clause-Patent + +**/ + +#include +#include + +/** + S3 PEI module entry point + + @param[in] FileHandle Not used. + @param[in] PeiServices General purpose services available to every PEIM. + + @retval EFI_SUCCESS The function completes successfully + @retval EFI_OUT_OF_RESOURCES Insufficient resources to create database +**/ +EFI_STATUS +EFIAPI +S3PeiEntryPoint ( + IN EFI_PEI_FILE_HANDLE FileHandle, + IN CONST EFI_PEI_SERVICES **PeiServices + ) +{ + EFI_STATUS Status; + + // + // Install EFI_PEI_MM_ACCESS_PPI for S3 resume case + // + Status = PeiInstallSmmAccessPpi (); + + return Status; +} diff --git a/Features/Intel/PowerManagement/S3FeaturePkg/Readme.md b/Features/Intel/PowerManagement/S3FeaturePkg/Readme.md new file mode 100644 index 0000000000..91ea3da854 --- /dev/null +++ b/Features/Intel/PowerManagement/S3FeaturePkg/Readme.md @@ -0,0 +1,86 @@ +# Overview +* **Feature Name:** S3 +* **PI Phase(s) Supported:** PEI +* **SMM Required?** Yes + +## Purpose +*_TODO_* +Simple overview that describes the purpose of the feature. In general, this should be no longer than one paragraph. + +# High-Level Theory of Operation +*_TODO_* +A description of how the device works at a high-level. + +The description should not be constrained to implementation details but provide a simple mental model of how the +feature is supposed to work. + +## Firmware Volumes +*_TODO_* +A bulleted list of the firmware volumes that feature module(s) are placed in. + +## Modules +*_TODO_* +A bulleted list of the modules that make up the feature. + +## +*_TODO_* +Each module in the feature should have a section that describes the module in a level of detail that is useful +to better understand the module source code. + +## +*_TODO_* +Each library in the feature should have a section that describes the library in a level of detail that is useful +to better understand the library source code. + +## Key Functions +*_TODO_* +A bulleted list of key functions for interacting with the feature. + +Not all features need to be listed. Only functions exposed through external interfaces that are important for feature +users to be aware of. + +## Configuration +*_TODO_* +Information that is useful for configuring the feature. + +Not all configuration options need to be listed. This section is used to provide more background on configuration +options than possible elsewhere. + +## Data Flows +*_TODO_* +Architecturally defined data structures and flows for the feature. + +## Control Flows +*_TODO_* +Key control flows for the feature. + +## Build Flows +*_TODO_* +Any special build flows should be described in this section. + +This is particularly useful for features that use custom build tools or require non-standard tool configuration. If the +standard flow in the feature package template is used, this section may be empty. + +## Test Point Results +*_TODO_* +The test(s) that can verify porting is complete for the feature. + +Each feature must describe at least one test point to verify the feature is successful. If the test point is not +implemented, this should be stated. + +## Functional Exit Criteria +*_TODO_* +The testable functionality for the feature. + +This section should provide an ordered list of criteria that a board integrator can reference to ensure the feature is +functional on their board. + +## Feature Enabling Checklist +*_TODO_* +An ordered list of required activities to achieve desired functionality for the feature. + +## Common Optimizations +*_TODO_* +Common size or performance tuning options for this feature. + +This section is recommended but not required. If not used, the contents should be left empty. -- 2.16.2.windows.1