Re: [PATCH V1 1/1] OvmfPkg/IntelTdxX64: Raise DXEFV size to 13MB

["Gerd Hoffmann" <kraxel@redhat.com>]

On Fri, Jan 06, 2023 at 12:49:21AM +0000, Xu, Min M wrote:
> On January 5, 2023 7:32 PM, Gerd Hoffmann wrote:
> > 
> > On Thu, Jan 05, 2023 at 03:21:05PM +0800, Min Xu wrote:
> > > From: Min M Xu <min.m.xu@intel.com>
> > >
> > > BZ: https://bugzilla.tianocore.org/show_bug.cgi?id=4236
> > >
> > > Similarly to the "cadence" mentioned in commit d272449 ("OvmfPkg:
> > > raise DXEFV size to 11 MB", 2018-05-29), it's been ~1.75 years since
> > > commit 5e75c4d ("OvmfPkg: raise DXEFV size to 12 MB", 2020-03-11), and
> > > we've outgrown DXEFV again (with NOOPT builds).  Increase the DXEFV
> > > size of IntelTdxX64 to 13MB now.
> > 
> > Not sure this makes sense given that you want split DXEFV into two smaller
> > volumes for IntelTdx (patch series sent in december IIRC).
> > 
> Thanks Gerd for the comments.
> I think raising DXEFV size and split DXEFV into 2 FVs are for different purpose and they're not conflicted.
> 
> The purpose of raising DXEFV size is to enlarge the FV so that more drivers can be hosted.
> 
> The purpose of splitting DXEFV are:
> 1) Reduce the attack surface in CC guest.
> 2) Improve boot perf in CC guest.

This also makes DXEFV smaller to make room for the new Firmware Volume.
So you change DXEFV size twice in a row.  I would avoid that and just
pick reasonable sizes for both volumes in the split patch series
instead.

take care,
  Gerd