From mboxrd@z Thu Jan 1 00:00:00 1970 Authentication-Results: mx.groups.io; dkim=missing; spf=pass (domain: intel.com, ip: 134.134.136.65, mailfrom: liming.gao@intel.com) Received: from mga03.intel.com (mga03.intel.com [134.134.136.65]) by groups.io with SMTP; Wed, 15 May 2019 06:29:02 -0700 X-Amp-Result: SKIPPED(no attachment in message) X-Amp-File-Uploaded: False Received: from fmsmga006.fm.intel.com ([10.253.24.20]) by orsmga103.jf.intel.com with ESMTP/TLS/DHE-RSA-AES256-GCM-SHA384; 15 May 2019 06:29:01 -0700 X-ExtLoop1: 1 Received: from fmsmsx105.amr.corp.intel.com ([10.18.124.203]) by fmsmga006.fm.intel.com with ESMTP; 15 May 2019 06:29:01 -0700 Received: from fmsmsx115.amr.corp.intel.com (10.18.116.19) by FMSMSX105.amr.corp.intel.com (10.18.124.203) with Microsoft SMTP Server (TLS) id 14.3.408.0; Wed, 15 May 2019 06:29:01 -0700 Received: from shsmsx101.ccr.corp.intel.com (10.239.4.153) by fmsmsx115.amr.corp.intel.com (10.18.116.19) with Microsoft SMTP Server (TLS) id 14.3.408.0; Wed, 15 May 2019 06:29:01 -0700 Received: from shsmsx104.ccr.corp.intel.com ([169.254.5.33]) by SHSMSX101.ccr.corp.intel.com ([169.254.1.129]) with mapi id 14.03.0415.000; Wed, 15 May 2019 21:28:59 +0800 From: "Liming Gao" To: "Kubacki, Michael A" , "Chaganty, Rangasai V" CC: "devel@edk2.groups.io" Subject: [RFC][edk2-platform][Add new packages in Platform\Intel directory] Thread-Topic: [RFC][edk2-platform][Add new packages in Platform\Intel directory] Thread-Index: AdUK6rfusMDCE4DuR+SFItTEQl41Lw== Date: Wed, 15 May 2019 13:28:58 +0000 Message-ID: <4A89E2EF3DFEDB4C8BFDE51014F606A14E44B6F0@SHSMSX104.ccr.corp.intel.com> Accept-Language: en-US X-MS-Has-Attach: X-MS-TNEF-Correlator: x-ctpclassification: CTP_NT x-titus-metadata-40: eyJDYXRlZ29yeUxhYmVscyI6IiIsIk1ldGFkYXRhIjp7Im5zIjoiaHR0cDpcL1wvd3d3LnRpdHVzLmNvbVwvbnNcL0ludGVsMyIsImlkIjoiYzRlZGNmMGUtMmMyNS00NjY1LThlYzEtMTI3MGYzYmMyZjcyIiwicHJvcHMiOlt7Im4iOiJDVFBDbGFzc2lmaWNhdGlvbiIsInZhbHMiOlt7InZhbHVlIjoiQ1RQX05UIn1dfV19LCJTdWJqZWN0TGFiZWxzIjpbXSwiVE1DVmVyc2lvbiI6IjE3LjEwLjE4MDQuNDkiLCJUcnVzdGVkTGFiZWxIYXNoIjoicHJkb2lUYjlWTWlHK3k0QTFhRFJURldVWlwvSzZEQURLRnhHdERiNEJ3djk3MFE0RTFxSjRUNmNQdGlSMHFHS08ifQ== dlp-product: dlpe-windows dlp-version: 11.0.600.7 dlp-reaction: no-action x-originating-ip: [10.239.127.40] MIME-Version: 1.0 Return-Path: liming.gao@intel.com Content-Language: en-US Content-Type: multipart/alternative; boundary="_000_4A89E2EF3DFEDB4C8BFDE51014F606A14E44B6F0SHSMSX104ccrcor_" --_000_4A89E2EF3DFEDB4C8BFDE51014F606A14E44B6F0SHSMSX104ccrcor_ Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: quoted-printable Michael and Sai: Now, we have AcpiDebug module in Platform\Intel\AdvancedFeaturePkg for de= bug feature, and I also see new patch to add Cmos related libraries for boa= rd feature. To make those features be enabled separately, I propose to crea= te new packages for them. One is DebugAdvancedFeaturePkg for the debug rela= ted features, another is GenericBoardPkg for the common board features. If = there is new code to be added in Platform\Intel directory in future, new fe= ature package can be created for them. Thanks Liming --_000_4A89E2EF3DFEDB4C8BFDE51014F606A14E44B6F0SHSMSX104ccrcor_ Content-Type: text/html; charset="us-ascii" Content-Transfer-Encoding: quoted-printable

Michael and Sai:

 

  Now, we have AcpiDebug m= odule in Platform\Intel\AdvancedFeaturePkg for debug feature, and I also se= e new patch to add Cmos related libraries for board feature. To make those = features be enabled separately, I propose to create new packages for them. One is DebugAdvancedFeaturePkg for the de= bug related features, another is GenericBoardPkg for the common board featu= res. If there is new code to be added in Platform\Intel directory in future= , new feature package can be created for them.

 

Thanks

Liming

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