From mboxrd@z Thu Jan 1 00:00:00 1970 Authentication-Results: mx.groups.io; dkim=missing; spf=pass (domain: intel.com, ip: 192.55.52.43, mailfrom: liming.gao@intel.com) Received: from mga05.intel.com (mga05.intel.com [192.55.52.43]) by groups.io with SMTP; Tue, 25 Jun 2019 19:04:32 -0700 X-Amp-Result: SKIPPED(no attachment in message) X-Amp-File-Uploaded: False Received: from fmsmga007.fm.intel.com ([10.253.24.52]) by fmsmga105.fm.intel.com with ESMTP/TLS/DHE-RSA-AES256-GCM-SHA384; 25 Jun 2019 19:04:32 -0700 X-ExtLoop1: 1 X-IronPort-AV: E=Sophos;i="5.63,418,1557212400"; d="scan'208";a="163789455" Received: from fmsmsx107.amr.corp.intel.com ([10.18.124.205]) by fmsmga007.fm.intel.com with ESMTP; 25 Jun 2019 19:04:32 -0700 Received: from fmsmsx609.amr.corp.intel.com (10.18.126.89) by fmsmsx107.amr.corp.intel.com (10.18.124.205) with Microsoft SMTP Server (TLS) id 14.3.439.0; Tue, 25 Jun 2019 19:04:32 -0700 Received: from fmsmsx609.amr.corp.intel.com (10.18.126.89) by fmsmsx609.amr.corp.intel.com (10.18.126.89) with Microsoft SMTP Server (version=TLS1_2, cipher=TLS_ECDHE_RSA_WITH_AES_128_GCM_SHA256) id 15.1.1713.5; Tue, 25 Jun 2019 19:04:31 -0700 Received: from shsmsx152.ccr.corp.intel.com (10.239.6.52) by fmsmsx609.amr.corp.intel.com (10.18.126.89) with Microsoft SMTP Server (version=TLS1_2, cipher=TLS_ECDHE_RSA_WITH_AES_128_CBC_SHA256) id 15.1.1713.5 via Frontend Transport; Tue, 25 Jun 2019 19:04:31 -0700 Received: from shsmsx104.ccr.corp.intel.com ([169.254.5.185]) by SHSMSX152.ccr.corp.intel.com ([169.254.6.225]) with mapi id 14.03.0439.000; Wed, 26 Jun 2019 10:04:30 +0800 From: "Liming Gao" To: "Zhang, Shenglei" , "devel@edk2.groups.io" CC: "Feng, Bob C" Subject: Re: [edk2-platform patch 6/6] Silicon\Tools: Add top level Makefile and GNUMakefile Thread-Topic: [edk2-platform patch 6/6] Silicon\Tools: Add top level Makefile and GNUMakefile Thread-Index: AQHVJ9B3mu7MviMpGEeS9LtvZvEXhKatNyHg Date: Wed, 26 Jun 2019 02:04:29 +0000 Message-ID: <4A89E2EF3DFEDB4C8BFDE51014F606A14E48D5EE@SHSMSX104.ccr.corp.intel.com> References: <20190621012643.9352-1-shenglei.zhang@intel.com> <20190621012643.9352-7-shenglei.zhang@intel.com> In-Reply-To: <20190621012643.9352-7-shenglei.zhang@intel.com> Accept-Language: en-US X-MS-Has-Attach: X-MS-TNEF-Correlator: x-originating-ip: [10.239.127.40] MIME-Version: 1.0 Return-Path: liming.gao@intel.com Content-Language: en-US Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: quoted-printable Shenglei: See my comments.=20 Thanks Liming >-----Original Message----- >From: Zhang, Shenglei >Sent: Friday, June 21, 2019 9:27 AM >To: devel@edk2.groups.io >Cc: Feng, Bob C ; Gao, Liming >Subject: [edk2-platform patch 6/6] Silicon\Tools: Add top level Makefile a= nd >GNUMakefile > >Add FitGen into Makefile and GNUMakefile. > >Cc: Bob Feng >Cc: Liming Gao >Signed-off-by: Shenglei Zhang >--- > Silicon/Intel/Tools/GNUmakefile | 34 >+++++++++++++++++++++++++++++++++ > Silicon/Intel/Tools/Makefile | 31 ++++++++++++++++++++++++++++++ > 2 files changed, 65 insertions(+) > create mode 100644 Silicon/Intel/Tools/GNUmakefile > create mode 100644 Silicon/Intel/Tools/Makefile > >diff --git a/Silicon/Intel/Tools/GNUmakefile >b/Silicon/Intel/Tools/GNUmakefile >new file mode 100644 >index 0000000000..77cfc62250 >--- /dev/null >+++ b/Silicon/Intel/Tools/GNUmakefile >@@ -0,0 +1,34 @@ >+## @file >+# GNUmakefile for building C utilities. >+# >+# Copyright (c) 2018, Intel Corporation. All rights reserved.
>+# This software and associated documentation (if any) is furnished >+# under a license and may only be used or copied in accordance >+# with the terms of the license. Except as permitted by such >+# license, no part of this software or documentation may be >+# reproduced, stored in a retrieval system, or transmitted in any >+# form or by any means without the express written consent of >+# Intel Corporation. >+# >+## Please update license for BSD + Patent.=20 Thanks Liming >+ >+MAKEROOT =3D $(EDK_TOOLS_PATH)/Source/C >+ >+APPLICATIONS =3D \ >+ FitGen \ >+ >+SUBDIRS :=3D $(APPLICATIONS) >+ >+$(APPLICATIONS): $(MAKEROOT)/bin >+ >+.PHONY: subdirs $(SUBDIRS) >+subdirs: $(SUBDIRS) >+$(SUBDIRS): >+ $(MAKE) -C $@ >+ >+.PHONY: $(patsubst %,%-clean,$(sort $(SUBDIRS))) >+$(patsubst %,%-clean,$(sort $(SUBDIRS))): >+ -$(MAKE) -C $(@:-clean=3D) clean >+ >+clean: $(patsubst %,%-clean,$(sort $(SUBDIRS))) >+ >diff --git a/Silicon/Intel/Tools/Makefile b/Silicon/Intel/Tools/Makefile >new file mode 100644 >index 0000000000..e52c95b7b5 >--- /dev/null >+++ b/Silicon/Intel/Tools/Makefile >@@ -0,0 +1,31 @@ >+## @file >+# makefile for building C utilities. >+# >+# Copyright (c) 2019, Intel Corporation. All rights reserved.
>+# SPDX-License-Identifier: BSD-2-Clause-Patent >+# >+## >+ >+!INCLUDE $(EDK_TOOLS_PATH)\Source\C\Makefiles\ms.common >+ >+APPLICATIONS =3D \ >+ FitGen \ >+ >+all: $(APPLICATIONS) >+ @echo. >+ @echo ###################### >+ @echo # Build executables >+ @echo ###################### >+ @if not exist $(BIN_PATH) mkdir $(BIN_PATH) >+ @$(EDK_TOOLS_PATH)\Source\C\Makefiles\NmakeSubdirs.bat all $** >+ >+.PHONY: clean >+clean: $(APPLICATIONS) >+ @$(EDK_TOOLS_PATH)\Source\C\Makefiles\NmakeSubdirs.bat clean $** >+ >+.PHONY: cleanall >+cleanall: $(APPLICATIONS) >+ @$(EDK_TOOLS_PATH)\Source\C\Makefiles\NmakeSubdirs.bat cleanall >$** >+ >+!INCLUDE $(EDK_TOOLS_PATH)\Source\C\Makefiles\ms.rule >+ >-- >2.18.0.windows.1