Re: [PATCH] IntelSiliconPkg: Add package DSC file

["Yao, Jiewen" <jiewen.yao@intel.com>]

Reviewed-by: Jiewen.yao@intel.com

> -----Original Message-----
> From: Wu, Hao A
> Sent: Thursday, June 22, 2017 10:56 AM
> To: edk2-devel@lists.01.org
> Cc: Wu, Hao A <hao.a.wu@intel.com>; Yao, Jiewen <jiewen.yao@intel.com>
> Subject: [PATCH] IntelSiliconPkg: Add package DSC file
> 
> Cc: Jiewen Yao <jiewen.yao@intel.com>
> Contributed-under: TianoCore Contribution Agreement 1.0
> Signed-off-by: Hao Wu <hao.a.wu@intel.com>
> ---
>  IntelSiliconPkg/IntelSiliconPkg.dsc | 46
> +++++++++++++++++++++++++++++++++++++
>  1 file changed, 46 insertions(+)
>  create mode 100644 IntelSiliconPkg/IntelSiliconPkg.dsc
> 
> diff --git a/IntelSiliconPkg/IntelSiliconPkg.dsc
> b/IntelSiliconPkg/IntelSiliconPkg.dsc
> new file mode 100644
> index 0000000000..f77f2a966e
> --- /dev/null
> +++ b/IntelSiliconPkg/IntelSiliconPkg.dsc
> @@ -0,0 +1,46 @@
> +## @file
> +# This package provides common open source Intel silicon modules.
> +#
> +# Copyright (c) 2017, Intel Corporation. All rights reserved.<BR>
> +#
> +#    This program and the accompanying materials
> +#    are licensed and made available under the terms and conditions of the
> BSD License
> +#    which accompanies this distribution. The full text of the license may be
> found at
> +#    http://opensource.org/licenses/bsd-license.php
> +#
> +#    THE PROGRAM IS DISTRIBUTED UNDER THE BSD LICENSE ON AN "AS IS"
> BASIS,
> +#    WITHOUT WARRANTIES OR REPRESENTATIONS OF ANY KIND, EITHER
> EXPRESS OR IMPLIED.
> +#
> +##
> +
> +[Defines]
> +  PLATFORM_NAME                  = IntelSiliconPkg
> +  PLATFORM_GUID                  =
> 9B96228E-1155-4967-8E16-D0ED8E1B4297
> +  PLATFORM_VERSION               = 0.1
> +  DSC_SPECIFICATION              = 0x00010005
> +  OUTPUT_DIRECTORY               = Build/IntelSiliconPkg
> +  SUPPORTED_ARCHITECTURES        = IA32|X64
> +  BUILD_TARGETS                  = DEBUG|RELEASE|NOOPT
> +  SKUID_IDENTIFIER               = DEFAULT
> +
> +############################################################
> #######################################
> +#
> +# Components Section - list of the modules and components that will be
> processed by compilation
> +#                      tools and the EDK II tools to generate
> PE32/PE32+/Coff image files.
> +#
> +# Note: The EDK II DSC file is not used to specify how compiled binary images
> get placed
> +#       into firmware volume images. This section is just a list of modules to
> compile from
> +#       source into UEFI-compliant binaries.
> +#       It is the FDF file that contains information on combining binary files
> into firmware
> +#       volume images, whose concept is beyond UEFI and is described in PI
> specification.
> +#       Binary modules do not need to be listed in this section, as they should
> be
> +#       specified in the FDF file. For example: Shell binary (Shell_Full.efi), FAT
> binary (Fat.efi),
> +#       Logo (Logo.bmp), and etc.
> +#       There may also be modules listed in this section that are not required
> in the FDF file,
> +#       When a module listed here is excluded from FDF file, then
> UEFI-compliant binary will be
> +#       generated for it, but the binary will not be put into any firmware
> volume.
> +#
> +############################################################
> #######################################
> +
> +[Components]
> +  IntelSiliconPkg/Library/DxeSmbiosDataHobLib/DxeSmbiosDataHobLib.inf
> --
> 2.12.0.windows.1