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From: "Nate DeSimone" <nathaniel.l.desimone@intel.com>
To: "Oram, Isaac W" <isaac.w.oram@intel.com>,
	"devel@edk2.groups.io" <devel@edk2.groups.io>
Cc: "Chaganty, Rangasai V" <rangasai.v.chaganty@intel.com>,
	"Gao, Liming" <gaoliming@byosoft.com.cn>,
	"Chiu, Chasel" <chasel.chiu@intel.com>,
	"Dong, Eric" <eric.dong@intel.com>,
	Benjamin Doron <benjamin.doron00@gmail.com>
Subject: Re: [edk2-devel][edk2-platforms][PATCH V1 0/2] Platforms/Intel: Build fixes
Date: Tue, 11 Oct 2022 23:40:12 +0000	[thread overview]
Message-ID: <MW4PR11MB582195D7F021F38A81F74E02CD239@MW4PR11MB5821.namprd11.prod.outlook.com> (raw)
In-Reply-To: <20220914184027.1510-1-isaac.w.oram@intel.com>

For the series...

Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>

-----Original Message-----
From: Oram, Isaac W <isaac.w.oram@intel.com> 
Sent: Wednesday, September 14, 2022 11:40 AM
To: devel@edk2.groups.io
Cc: Oram, Isaac W <isaac.w.oram@intel.com>; Chaganty, Rangasai V <rangasai.v.chaganty@intel.com>; Desimone, Nathaniel L <nathaniel.l.desimone@intel.com>; Gao, Liming <gaoliming@byosoft.com.cn>; Chiu, Chasel <chasel.chiu@intel.com>; Dong, Eric <eric.dong@intel.com>; Benjamin Doron <benjamin.doron00@gmail.com>
Subject: [edk2-devel][edk2-platforms][PATCH V1 0/2] Platforms/Intel: Build fixes

The S3FeaturePkg changes in
  [edk2-platforms][PATCH v3 2/4] S3FeaturePkg: Implement working S3 resume

Introduces some build issues with standalone package build for S3FeaturePkg and AdvancedFeaturePkg.  There are also some type cast related compiler warnings.

We do not currently have continuous integration testing.
We do not currently have documented build testing configuration requirements.
Therefore I am just fixing the minor issues and intend to merge both patch series together to maintain git bisect to the best of my ability.
I do plan to document required and recommended board port and feature pkg builds.

Note that the use of UINTN for intermediate data instead of EFI_PHYSICAL_ADDRESS is only to be consistent with other ACPI implementations of similar functionality.

Cc: Sai Chaganty <rangasai.v.chaganty@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Liming Gao <gaoliming@byosoft.com.cn>
Cc: Chasel Chiu <chasel.chiu@intel.com>
Cc: Eric Dong <eric.dong@intel.com>
Cc: Benjamin Doron <benjamin.doron00@gmail.com>
Signed-off-by: Isaac Oram <isaac.w.oram@intel.com>

Isaac Oram (2):
  S3FeaturePkg/Build: Add libraries needed by S3FeaturePkg
  MinPlatformPkg/S3: Use EFI_PHYSICAL_ADDRESS for address

 .../Intel/AdvancedFeaturePkg/AdvancedFeaturePkg.dsc    |  3 +++
 .../Intel/PowerManagement/S3FeaturePkg/S3Dxe/S3Dxe.c   | 10 +++++-----
 .../PowerManagement/S3FeaturePkg/S3FeaturePkg.dsc      |  3 +++
 .../Intel/PowerManagement/S3FeaturePkg/S3Pei/S3Pei.c   |  2 +-
 .../Intel/MinPlatformPkg/Include/AcpiS3MemoryNvData.h  |  4 ++--
 5 files changed, 14 insertions(+), 8 deletions(-)

--
2.36.1.windows.1

  parent reply	other threads:[~2022-10-11 23:40 UTC|newest]

Thread overview: 7+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2022-09-14 18:40 [edk2-devel][edk2-platforms][PATCH V1 0/2] Platforms/Intel: Build fixes Isaac Oram
2022-09-14 18:40 ` [edk2-devel][edk2-platforms][PATCH V1 1/2] S3FeaturePkg/Build: Add libraries needed by S3FeaturePkg Isaac Oram
2022-09-14 18:40   ` [edk2-devel][edk2-platforms][PATCH V1 2/2] MinPlatformPkg/S3: Use EFI_PHYSICAL_ADDRESS for address Isaac Oram
2022-09-28 16:16 ` [edk2-devel] [edk2-platforms][PATCH V1 0/2] Platforms/Intel: Build fixes Benjamin Doron
2022-09-28 17:22   ` Isaac Oram
2022-10-11 23:40 ` Nate DeSimone [this message]
2022-10-12  1:33   ` [edk2-devel][edk2-platforms][PATCH " Isaac Oram

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